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Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026

Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026

Aehr Test Systems will meet investors on August 25, 2026, amid increasing demand for wafer-level and package-level test and burn-in solutions supporting AI processors, silicon photonics, electric vehicles, power semiconductors and data infrastructure.

Aehr Test Systems (NASDAQ:AEHR) will participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 24-25, 2026, at the Four Seasons Hotel in Chicago. President and CEO Gayn Erickson and CFO Chris Siu will hold investor meetings on August 25. The Fremont, California-based company provides test, burn-in and stabilization solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data centers, automotive and industrial applications. Management said Aehr is seeing strong traction with AI processors in wafer-level and package-level formats, and expects broader adoption of these testing methods to be a significant growth driver. Aehr’s turnkey solutions address quality, reliability and yield requirements for AI processors in cloud computing and data centers; silicon carbide devices for electric vehicles and charging infrastructure; gallium nitride for advanced power conversion; and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). The company has installed thousands of systems worldwide. Its applications also include solar and wind power, computing, telecommunications infrastructure, and solid-state memory and storage. Its portfolio includes the FOX-PTM families, FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. FOX-XP and FOX-NP systems test, burn in and stabilize wafers, singulated die and modules, including silicon carbide power semiconductors, 2D and 3D sensors, memory, processors, microcontrollers, systems-on-a-chip, photonics and integrated optical devices. FOX-CP is a compact, single-wafer solution for logic, memory and photonic devices. The FOX WaferPak Contactor supports wafers up to 300mm. The FOX DiePak Carrier supports up to 1,024 devices in parallel, with as many as nine DiePaks operating simultaneously on FOX-NP and FOX-XP systems. Following its acquisition of Incal Technology, Inc., Aehr added package-level reliability and burn-in solutions, including the ultra-high-power Sonoma family for AI accelerators, GPUs and high-performance computing processors. Investors seeking meetings can contact Jefferies or Aehr’s investor-relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

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